Electronics Manufacturing System:CPF-07

Clean and soft peeling.

Peeling method using stick tape can keep clean with soft contact.
No damage on resist film and core substrate which can not be solved in current methods. (Patent pending)

Wide application for various lamination types.

Reliable peeling method applied for various kinds of lamination such as framed, whole lamination etc.

High economical method.

Small consumption of stick tape for peeling coverfilm and small air consumption besides, not noizy.

High reliability.

Application of original peeling method using stick tape realizes high reliable peeler.

Standard Specifications

Model			CPF-07
Peeling Method		-	Floating by Stick Tape
Board Size	Width	mm	340~700
	Length	mm	340~700
	Thickness	mm	0.06~3.2
Through-put		plate/Hr	360
Dimensions (L x W x H)		mm	250 x 1500 x 1600

• *This product is an export-controled item, which is restricted to deliver to certain countries and areas. For details,please contact us before shipping.