Electronics Manufacturing System:DFC-R09U~R16U

Uses

Lamination of dry film such for rib formation and electrode formation on large glass substrate.

Features

-Lamination with no wrinkle. (Lamination with constant film tension on whole substrate)
-No air void at top and rear ends of substrate. (Continuous laminating operation)
-No foreign material stick. (Film cutting after finishing lamination)
-Framed lamination available. (Space film treatment before lamination)
-Lamination with high adhesion and high uniformity. (Special lamination roll is used)
-Lamination with high accuracy is available as option. (Film position accuracy on substrate : within ±0.5mm)

Standard Specifications

Model		DFC-R09U	DFC-R13U	DFC-R16U
Maximum Board Size	mm	900	1250	1600
Lamination speed	m/min	0.5~3.0
Roll Pressure	N/cm	30~50
Roll Temperature	°C	Ambient~150
Distribution of Roll Temp.	°C	less than ±3.5
Lamination roll	-	Induction heating roll
Weight(Approx)	kg	2000	2500	3500

Dimension

• *This product is an export-controled item, which is restricted to deliver to certain countries and areas. For details,please contact us before shipping.